Teledyne Microelectronic Technologies Validated as a Full Service Provider for the Ready for IBM Technology (RFIT) Program

Teledyne Microelectronic Technologies, a division of Teledyne Technologies Incorporated (NYSE:TDY), announced today it has been validated as a full service provider for the Ready for IBM Technology (RFIT) program. Teledyne Microelectronic Technologies is a design and packaging developer excelling in both high-speed prototype turnaround and low and high volume production to meet customer schedule and specification requirements. The fabrication is in a non-captive facility that can facilitate customer time to market with technology driven and cost effective packaging solutions.

The Ready for IBM Technology program is intended to help IBM's foundry customers speed time to market, reduce development risk, lower development costs and improve return on investment by identifying design centers that have tested and validated their methodologies for compatibility with IBM Technologies.

Bruce Gecks, VP and General Manager of Teledyne Microelectronic Technologies said, "We are pleased to be a part of IBM's RFIT program and will commit our facility resources, both personnel and equipment, to meet and exceed the requirements of our customers".

"We welcome Teledyne Microelectronic Technologies into the Ready for IBM Technology program," said Ned Cahoon, Manager of IBM's Foundry Business Development. "Teledyne's design services and manufacturing capabilities can provide IBM foundry customers with additional choices and flexibility to help meet their requirements."

Teledyne Technologies Incorporated is a leading provider of sophisticated electronics components, instruments and communication products, systems engineering solutions, and aerospace products and components and on-site gas and power generation systems. Teledyne Technologies has operations in the United States, the United Kingdom, Canada and Mexico. For more information, visit Teledyne Technologies' website at www.teledyne.com

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