Teledyne Printed Circuits is an innovative, full service provider of interconnect technologies including multi-layer flexible and rigid-flex printed circuits, assemblies, backplanes, HDI, and VME-FlexTM. These technologies integrate a flexible region that eliminates connectors, daughter/mezzanine cards, and other hardware. Teledyne Printed Circuits offers full engineering services, applications, design, concurrent engineering, mock-ups, prototypes and full rate production up to 40 layers. AS9100/ISO 9001 certified. MIL-P-50884, IPC-6013 qualified and Nadcap accredited.